Akasa AK-TT300-02, 30x30mm
Thermal Adhesive Tape - fills uneven surfaces between heatsink and chip, dissipates waste heat, dimensions: 30 × 30 × 5 mm
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Code:
UF148c
Producer's Website:
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Akasa AK-TT300-02, 30x30mm
Discontinued
Akasa AK-TT300-02, 30x30mm
A thermal adhesive tape with dimensions 30 x 30 x 5mm from Akasa, which will reliably fill uneven surfaces between the heatsink and the chipset and remove waste heat of the components. The tape can be trimmed and easily adjusted to the size of the contact area.
Specifications:
Dimensions:
30 x 30 x 5mm
Thermal conductivity:
1.2 W/mK
Hardness:
27
Density:
1.78 g/cc
Temperature range:
From -40°C to 160°C
Resistivity:
1013 ohm-cm
Coefficient of thermal expansion (CTE):
600 ppm/C
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Specifications
Thermal Conductivity
Density
Weight
Thermal Conductivity
Length
Specific Features
Thermal Conductivity
Density
Packaging
Weight
Thermal conductivity
Thermal Conductivity
Dimensions
Length
Width
Height
More Specifications
Akasa Holland BV, De Donge 17, 5684 PX Best The Netherlands, [email protected]
Note:
Specifications can be changed without notice. Images are for illustrative purposes only.
